Polyimide Coated Acrylic Adhesive Tapes
3M™ Low Static, Non-Silicone Polyimide Film Tape 7419 with DuPont™ Kapton® polyimide film and acrylic adhesive is
amber-colored and used for PCB solder masking and other high temperature applications.
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Polyimide Coated Acrylic Adhesive Tapes
Product Name:7419,7419L
Backing:Dupont™ Kapton® Polyimide Film
Adhesive:Acrylic(Non-Silicone)
Color:Amber
Standard Roll Length:33m/66 m/100 m
Product Description:
3M™ Low Static, Non-Silicone Polyimide Film Tape 7419 with DuPont™ Kapton® polyimide film and acrylic adhesive is amber-colored and used for PCB solder masking and other high temperature applications.
Features
- Specially formulated acrylic adhesive is resistant to typical solder mask temperatures for short periods of time.
- Stays firmly in place during processing and removes cleanly from typical electronic substrates even after 10 min @ 260°C (500°F).
- Non-silicone adhesive formulation lessens the potential for silicone contamination which can interfere with subsequent bonding or conformal coating operations.
- The high temperature acrylic adhesive also has excellent chemical resistance and should be considered for demanding chemical masking applications.
- Product is wound on a polyethylene tape core
Backing
Kapton Polyimide Film
Adhesive
Acrylic(Non-silicone)
Color
Amber
Standard Roll Length
33m/66m/100m
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Polyester Tapes
Polyester films offer excellent thermal, abrasion, and chemical resistance while maintaining their flexibility. Silicone adhesives offer high heat resistance compared to many rubber and acrylic adhesives, reducing failure due to softening, oozing and adhesive transfer. Silicone adhesives adhere well to tough-to-stick-to surfaces like silicone liners and fixtures coated with mold release. Removes cleanly from stainless steel, anodized aluminum and glass after a 5 hour. bake cycle at 350°F (177°C). Variety of tape thicknesses offered allows uses for multiple applications.
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Application Ideas
- Masking or protecting residue sensitive areas on printed circuit boards during high temperature operations such as wave soldering and solder reflow
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Typical Physical Properties
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| 7419 | 8902 | 8905 | ASTM Test Method | ||
| Adhesion to Steel | 4.75N/IN | 37 (40) | 26 (28) | oz./in. (N/100mm) | D-3330 |
| Backing Thickness | 0.025 mm | 37 (40) | 26 (28) | oz./in. (N/100mm) | D-3652 |
| Total Thickness | 0.046 mm | 37 (40) | 26 (28) | oz./in. (N/100mm) | D-3652 |
| Static Discharge Removal from roll | < 100 volts | 37 (40) | 26 (28) | oz./in. (N/100mm) | D-3330 |
| Surface Resistivity | 5 x 106 ohms/sq | 37 (40) | 26 (28) | oz./in. (N/100mm) | ESD Method S-11 |
| Temperature Use Range: | 10 min at 260°C | 37 (40) | 26 (28) | oz./in. (N/100mm) | D-3330 |
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Download Brochure
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| Model: | Download |
| 8853 | |
| 8854 |
