UV Dicing Tape
- Dicing Tape (UV, Non-UV)
- Package Dicing Tape -for IC/LED wafer package cutting
- UV Dicing Tape for Si/GaAs Wafer Dicing
- UV Dicing Tape for Functional Devices for MEMS/Filter/Glass Substrate Cutting
ARIS
Thermal Release Tape
Thermal Release tape is a special functional tape which functions as a regular tape sticking to a substrate or bonding two surfaces together under certain temperature; however it debonds at another temperature, typically higher temperatureas .Therefore it is quite useful for those applications where bonding and debonding are both required in the process.
- For temporary fixing in cutting and dicing processes
- Provides enough holding adhesion during dicing operation at regular temperature, objects are not moved, nor flying. Easily released after heating.
- Thermal release temperature：80℃，90℃，120℃，150℃，190℃ and 230℃
- For wafer dicing, chip dicing, MLCC dicing, LED dicing, substrate cutting, lens cutting, nameplate cutting or any semiconductor Industry production process.
- Electronic component manufacturing process，Glass polishing
Features
- Adhesive strength becomes almost “zero” by heating and thermal release tape can be removed without damaging substrates.
- Substrates can be processed by temporarily fixing a thermal release tape’s pressure sensitive adhesive face to the stage.
- Provides a high processing accuracy since substrates are kept in a fixed position.
- Three types (pre-cut tape rolls, labelers and sheets) are available.
- Environmentally friendly since no cleaning is required for substrates.
Backing
PO/PVC/PET/PI
Adhesive
Acrylic
Color
Clear/Blue/Milky White/Brown/Orange
Standard Roll Length
• Widths from 1/4″ to 23″
• Longer lengths up to several times normal length, dependent upon width. Check with Customer Service
ARIS
Dicing Tape for LED Packages
NON-UV TAPE (BLUE TAPE)
Dicing Tape for LED Packages
■ This dicing tape is used for molded LED packages.
■ Sufficient adhesion reduces risk of package damage during dicing.
ARIS
Application Ideas
- Semiconductor Wafer Dicing
- Electrical, Electronic Components, LED Dicing
- Glass, Ceramic, PCB Dicing
- Dicing silicon wafers into dies or chips.
- Temporarily securing wafers on dicing frames during sawing.
- Sorting, picking and placing diced semiconductor dies.
- Ejecting dies quickly after UV exposure for further assembly.
- Protecting delicate micro-structures on wafer surface.
- Improving throughput and yield in die sorting processes.
ARIS
Typical Physical Properties
ARIS provides the best possible solution to you in the semiconductor manufacturing process with the following features.
The requirements of technology for the dicing process have been on the rise due to the recent trend of downsized electronic devices and the surge in demand for semiconductor chips. We are committed to customizing our solutions to meet your specific requirements.
Our No.6360 series constitutes a dicing tape crafted by applying a UV release adhesive onto a highly isotropic polyolefin base material. This tape ensures secure fixation of workpieces during dicing, allowing for easy retrieval of chips through UV light irradiation.
| Application | Feature | Base Material | Primal Product Name |
| For Si Wafer | High Expandability | PVC | D-17XD series |
| PO | D-670/D-675(S) | ||
| Anti-Chipping | PVC | D-171D/D-175D*/D-176D | |
| PO | D-495H/D-497/D-676H(S) | ||
| Easy Pick-up | PVC | D-175D* | |
| PO | D-485H/ D-489H | ||
| Antistatic | PVC | D-820/ D-821HSD | |
| PO | D-877H/D-888H | ||
| High Adhesion | PO | D-611/D-611H/D-628 | |
| For Glass/ Ceramics | Standard | PET | D-210N/ D-241 |
| PO | D-825/D-841 | ||
| PO | D-846 | ||
| For Package Substrate | Standard | PO | D-510T(S)/D-510W/D-513W |
| PO | D-825/ D-830J/D-841/D-841W/D-847W | ||
| For Stealth DicingTM | Expand Singulation | PVC | D-171D/ D-175D* |
| PO | D-485H/D-611H/D-678 | ||
| Expand Singulation & Through Tape Dicing | PVC | D-821HSD | |
| PO | D-455H | ||
| For TAIKO Wafer | Standard | PVC | D-174D/ D-175D* |
| PO | D-485H/ D-489H/ D495H |
ARIS
Download Brochure
Tapes for seminconductor manufacturing process
Dicing tape for wafer / Dicing tape for circuit board
Thermal Release Tape for Electronic Component Processing /PCB/ Wafer /MCLL
| Model: | Download |
| UV Dicing Tape | PDF.UV Dicing tape better |
| 8854 |
